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An effective system development paradigm and its associated design tools can streamline the production of flexible manufacturing systems. In view of the technological advances in developing complex manufacturing systems, a framework and its associated graphical development environment are presented in this paper. This framework aims at providing a unified platform to develop complex manufacturing systems with enhanced formality. Features include procedures for requirement analysis, simulation of system behavior, and formal verification of abstract implementation. The proposed framework helps to shorten lifecycle for system designs and helps engineers to produce manufacturing systems that conform better with original specifications with better quality. A flexible conveyor‐based production system is chosen as a case example to illustrate the capabilities of the proposed framework.

The purpose of this paper is to focus on through‐silicon via (TSV), with a new concept that every chip or interposer could have two surfaces with circuits. Emphasis is placed on the 3D IC integration, especially the interposer (both active and passive) technologies and their roadmaps. The origin of 3D integration is also briefly presented.

This design addresses the electronic packaging of 3D IC integration with a passive TSV interposer for high‐power, high‐performance, high pin‐count, ultra fine‐pitch, small real‐estate, and low‐cost applications. To achieve this, the design uses chip‐to‐chip interconnections through a passive TSV interposer in a 3D IC integration system‐in‐package (SiP) format with excellent thermal management.

A generic, low‐cost and thermal‐enhanced 3D IC integration SiP with a passive interposer has been proposed for high‐performance applications. Also, the origin of 3D integration and the overview and outlook of 3D Si integration and 3D IC integration have been presented and discussed. Some important results and recommendations are summarized: the TSV/redistribution layer (RDL)/integrated passive devices passive interposer, which supports the high‐power chips on top and low‐power chips at its bottom, is the gut and workhorse of the current 3D IC integration design; with the passive interposer, it is not necessary to “dig” holes on the active chips. In fact, try to avoid making TSVs in the active chips; the passive interposer provides flexible coupling for whatever chips are available and/or necessary, and enhances the functionality and possibly the routings (shorter); with the passive interposer, the TSV manufacturing cost is lower because the requirement of TSV manufacturing yield is too high (>99.99 percent) for the active chips to bear additional costs due to TSV manufacturing yield loss; with the passive interposer, wafer thinning and thin‐wafer handling costs (for the interposer) are lower because these are not needed for the active chips and thus adds no cost due to yield loss; with the current designs, all the chips are bare; the packaging cost for individual chips is eliminated; more than 90 percent of heat from the 3D IC integration SiP is dissipated from the backside of high‐power chips using a thermal interface material and heat spreader/sink; the appearance and footprint of current 3D IC integration SiP designs are very attractive to integrated device manufactures, original equipment manufactures, and electronics manufacturing services (EMS) because they are standard packages; and underfills between the copper‐filled TSV interposer and the high‐ and low‐power chips are recommended to reduce creep damage of the lead‐free microbump solder joints and prolong their lives.

The paper's findings will be very useful to the electronic industry.

The purpose of this paper is to propose an outcome-based process optimization model which can be deployed in companies to enhance their business operations, strengthening their competitiveness in the current industrial environment. To validate the approach, a case example has been included to assess the practicality and validity of this approach to be applied in actual environment.

This model embraces two approaches including: fuzzy logic for mimicking the human thinking and decision making mechanism; and data mining association rules approach for optimizing the analyzed knowledge for future decision-making as well as providing a mechanism to apply the obtained knowledge to support the improvement of different types of processes.

The new methodology of the proposed algorithm has been evaluated in a case study and the algorithm shows its potential to determine the primary factors that have a great effect upon the final result of the entire operation comprising a number of processes. In this case example, relevant process parameters have been identified as the important factors causing significant impact on the result of final outcome.

The proposed methodology requires the dependence on human knowledge and personal experience to determine the various fuzzy regions of the processes. This can be fairly subjective and even biased. As such, it is advisable that the development of artificial intelligence techniques to support automatic machine learning to derive the fuzzy sets should be promoted to provide more reliable results.

Recent study on the relevant topics indicates that an intelligent process optimization approach, which is able to interact seamlessly with the knowledge-based system and extract useful information for process improvement, is still seen as an area that requires more study and investigation. In this research, the process optimization system with an effective process mining algorithm embedded for supporting knowledge discovery is proposed for use to achieve better quality control.

This research aims to identify, examine and evaluate barriers to the adoption of digital servitization in manufacturing firms in the case of the Sri Lankan manufacturing sector and analyze the inter-relationships among digital servitization barriers.

Based on the comprehensive literature review, 13 barriers were identified. The grey decision-making trial and evaluation laboratory (grey-DEMATEL) approach was used to uncover and analyze the relationships among barriers in terms of their overall influence and dependencies.

A prominent barrier to the success of adopting digital servitization in the Sri Lankan manufacturing sector is the lack of digital strategy in developing activities related to the design of digital service packages, organizational structures and processes. Supply chain integration is the most influential factor, which plays an important role in developing a competitive advantage by encouraging innovation process capabilities in servitized companies.

Industry practitioners can develop guidelines for adopting digital servitization practices based on the importance and interdependencies of different barriers and thereby prioritize projects within a program of digital servitization adoption in their organizations.

Research studies on barriers to digital servitization are limited to exploratory nature and have adopted mainly the qualitative approach, such as in-depth interviews. No empirical study has investigated the inter-relationships among digital servitization adoption barriers in the manufacturing sector. This study provides a holistic view of different barriers to the adoption of digital servitization in the manufacturing sector as a basis for developing comprehensive digital servitization strategies to manage and leverage complexity in digital transformation.

In the cold supply chain (SC), effective risk management is regarded as an essential component to address the risky and uncertain SC environment in handling time- and temperature-sensitive products. However, existing multi-criteria decision-making (MCDM) approaches greatly rely on expert opinions for pairwise comparisons. Despite the fact that machine learning models can be customised to conduct pairwise comparisons, it is difficult for small and medium enterprises (SMEs) to intelligently measure the ratings between risk criteria without sufficiently large datasets. Therefore, this paper aims at developing an enterprise-wide solution to identify and assess cold chain risks.

A novel federated learning (FL)-enabled multi-criteria risk evaluation system (FMRES) is proposed, which integrates FL and the best–worst method (BWM) to measure firm-level cold chain risks under the suggested risk hierarchical structure. The factors of technologies and equipment, operations, external environment, and personnel and organisation are considered. Furthermore, a case analysis of an e-grocery SC in Australia is conducted to examine the feasibility of the proposed approach.

Throughout this study, it is found that embedding the FL mechanism into the MCDM process is effective in acquiring knowledge of pairwise comparisons from experts. A trusted federation in a cold chain network is therefore formulated to identify and assess cold SC risks in a systematic manner.

A novel hybridisation between horizontal FL and MCDM process is explored, which enhances the autonomy of the MCDM approaches to evaluate cold chain risks under the structured hierarchy.

This chapter begins with a reflection on the call for investigating how entrepreneurial competencies are developed (Bird, 1995) in the context of university-based entrepreneurship centers. Through clarifying the nature of entrepreneurial competencies and applying a social constructivist perspective of learning, it is proposed that effective nurturing of entrepreneurial competencies for university students through entrepreneurship centers shall be based on five key characteristics; namely, active experimentation, authenticity, social interaction, sense of ownership, and scaffolding support. The chapter contributes to the literature through establishing a link between entrepreneurship education and entrepreneurial competencies in the context of university-based entrepreneurship centers, which have become an increasingly popular way for promoting entrepreneurial development. The practical implications on nurturing entrepreneurs through entrepreneurship centers are discussed, together with the directions for further research. This chapter is designed as a refection upon Bird’s original article articulating the concept of entrepreneurial competencies. In this chapter, the author outlines how entrepreneurial competencies can be developed through education programs, specifically via entrepreneurship centers.

Logistics practitioners must continually improve inventory management processes as they daily respond to the twin drivers of customer satisfaction and cost efficiency. The purpose of this paper is to investigate the scenario of sourcing goods through lateral transshipments in a periodic-review policy setting, against a backdrop of cost optimization objectives.

The authors develop decision rules that make cost-optimized selection between backordering and combined reactive and proactive lateral transshipment options possible. This necessarily takes account of the trade-off between purchasing, holding and backorder cost components. In addition, the authors use simulation studies to illustrate the superior performance of the proposed decision options.

According to results of the simulation studies, the proposed two-step decision rule generates the lower inventory cost than the alternative decisions rules. The outperformance of proposed two-step decision rule is valid in different scenario.

This study develops the decision rules to assist wholesaler logistics practitioners to make optimized decisions with regard to whether they should proactively lateral transshipments and if selected, the optimum size of the extra lateral transshipment.

This study has made a significant contribution to the existing knowledge base as it develops decision rules for a combined proactive and reactive approach using lateral transhipments to meet both urgent demand and a part of the demand expected during the supplier lead time in a cost-efficient way.